? RGP25A thru rgp25m vishay semiconductors formerly general semiconductor document number 88703 www.vishay.com 08-feb-02 1 glass passivated junction fast switching rectifier reverse voltage 50 to 1000v forward current 2.5a patented* maximum ratings & thermal characteristics ratings at 25c ambient temperature unless otherwise specified. rgp rgp rgp rgp rgp rgp rgp parameter symbol 25a 25b 25d 25g 25j 25k 25m unit maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a =55c i f(av) 2.5 a peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 100 a maximum full load reverse current, full cycle average0.375" (9.5mm) lead length at t a =55c i r(av) 100 a typical thermal resistance (1) r ja 20 c/w operating junction and storage temperature range t j , t stg -65 to +175 c electrical characteristics ratings at 25c ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 2.5a v f 1.3 v maximum dc reverse current t a =25c 5.0 at rated dc blocking voltage t a =125c i r 200 a maximum reverse recovery time i f =0.5a, i r =1.0a, i rr =0.25a t rr 150 250 500 ns typical junction capacitance at 4.0v, 1mhz c j 60 pf notes: (1) thermal resistance from junction to ambient at 0.375? (9.5mm) lead length, p.c.b. mounted do-201ad features plastic package has underwriters laboratories flammability classification 94v-0 high temperature metallurgically bonded construction cavity-free glass passivated junction 2.5 ampere operation at t a =55c with no thermal runaway typical i r less than 0.2 a capable of meeting environmental standards of mil-s-19500 high temperature soldering guaranteed: 350c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-201ad, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.04 oz., 1.12 g packaging codes/options: 1/bulk - 1.5k per container, 15k per box 4/1.4k per 13" reel, 5.6k per box 23/1k per ammo. mag., 9k per box 0.210 (5.3) 0.190 (4.8) dia. 0.052 (1.32) 0.048 (1.22) dia. 1.0 (25.4) min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) min. dimensions in inches and (millimeters) * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306
RGP25A thru rgp25m vishay semiconductors formerly general semiconductor www.vishay.com document number 88703 2 08-feb-02 1 10 100 10 100 20 40 60 80 100 120 140 160 180 0 0.5 1.0 1.5 2.0 2.5 3.0 10 100 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1.0 10 1 10 100 0 20 40 60 80 100 0.01 0.1 1.0 10 20 fig. 1 - forward derating curve fig. 2 - maximum non-repetitive peak forward surge current fig. 3 - typical instantaneous forward characteristics fig. 4 - typical reverse characteristics fig. 5 - typical junction capacitance ambient temperature ( c) average forward rectified current (a) 0.375" (9.5mm) lead length resistive or inductive load peak forward surge current (a) t j = t j max 8.3ms single half sine-wave (jedec method) number of cycles at 60 hz instantaneous forward voltage (v) instantaneous forward current (a) t j = 25 c pulse width = 300 s 1% duty cycle instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) t j = 125 c t j = 100 c t j = 75 c t j = 25 c reverse volt a ge (v) juncton capacitance (pf) t j = 25 c f = 1.0 mh z vsig = 50mvp-p ratings and characteristic curves (t a = 25 c unless otherwise noted)
|
